| PART |
Description |
Maker |
| 21-0181 |
PACKAGE OUTLINE, 43L THIN QFN, 3.5*9*0.8MM
|
Maxim Integrated Products
|
| 21-0136F |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm 封装外形12,16蜇薄QFN3x3x0.8mm
|
Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| LTC3210EUDTRPBF LTC3210EUD LTC3210EUD-1 LTC3210EUD |
MAIN/CAM LED Controller in 3mm x 3mm QFN
MAIN/CAM LED Controller in 3mm 3mm QFN
MAIN/CAM LED Controller in 3mm × 3mm QFN; Package: QFN; No of Pins: 16; Temperature Range: -40°C to 125°C LED DISPLAY DRIVER, PQCC16
MAIN/CAM LED Controller in 3mm 3mm QFN
|
Linear Integrated Systems
Linear Technology, Corp.
|
| SSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
